Technology lab for nano and microsystems

Innovations at the nano scale

Researchers dressed in protective clothing working at a computer

Innovative miniaturised systems are developed in the Technology Laboratory for Nano and Microsystems (TNM).

Nano and microsystems combine mechanical, optical, biological and electrical elements to realise innovative functions for sensors and actuators. These systems are of crucial importance in medicine, energy supply and materials science.

Students, employees and doctoral candidates can acquire practical knowledge in the laboratory and apply their knowledge in current research projects. Access to state-of-the-art technology and current research topics qualifies them for promising careers in a wide range of industries.

We work closely with companies and other research institutions in joint projects. Examples of our research activities can be found under the Internal link opens in the same window:Institute for Microsystems Technology.

Purpose of lab

Biosensor made of porous silicon by means of anodization

Tunable light source in the MIR range for photoacoustic sensors

Super hydrophobic surface made of porous silicon by means of anodization

The Technology Laboratory for Nano and Microsystems offers a wide range of opportunities for students, doctoral candidates and researchers. Here, students in the Internal link opens in the same window:Smart Systems and Internal link opens in the same window:Micromedical Engineering degree programmes can acquire basic skills in microsystems technology and characterisation in the clean room in various internships, and deepen their knowledge in assistant positions and theses.

Exciting opportunities open up after graduation − in third-party funded research projects, graduates can participate directly in innovative research and development processes as project collaborators. Many take the opportunity to do a doctorate at our university and thus lay the foundations for a successful academic career, as our university can award doctorates. Click here for more information about the Internal link opens in the same window:HFU doctoral programme.

Together with the Internal link opens in the same window:Rottweil Research Center, we form the Internal link opens in the same window:Institute for Microsystems Technology (iMST).

Sensors and actuators (micro-electro-mechanical systems, MEMS)
Optical systems (Micro-Opto-Electro-Mechanical Systems, MOEMS)
Electrochemical etching processes / anodization
Flexible electronics
Micromedicine
Intelligent implants
Embedded systems
3D micro- and nanostructuring
Self-organised systems in micro- and nanotechnology

Project planning and application
Technology consulting
System analysis / concept validation
Multiphysics - Simulation
Process development and implementation in micro- and nanotechnology
Production of prototypes
Characterisation

Technical equipment

Formerly known as the “micro laboratory”, our lab was one of the first microsystems technology laboratories in Germany, opened in 1984. Since then, innovative technologies have been continuously added to the laboratory's equipment. We operate an extensive silicon technology line and characterisation facility in several clean rooms covering an area of over 300 m². As a member of the Internal link opens in the same window:iMST, we have the opportunity to use the facilities of the Internal link opens in the same window:Rottweil Research Center and to cooperate with other research institutes.

Various devices are available for analyzing microsystems, whereby the FIB-SEM device is particularly noteworthy due to its versatility.

FIB-SEM: Scanning electron microscope with focused ^Ga+ ion beam
- Detectors: Inlens (SE and RE), SESI, sTEM, BSE
- With material characterisation: ToF-SIMS, EDX, EBSD
- Structuring using precursors
FT-IR with microscope
Optical 3D profiler (laser scanning microscope & white light interferometer)
Atomic force microscope (AFM)
Contact profilometer
Optical layer thickness measurement using ellipsometer and spectrometer
Capacitance-voltage measurement (4-point method)
Surface and pore size measurement using physisorption
Contact angle measurement
Vibration and distance measurement using laser interferometers and triangulation
As well as several microscopes and other small devices

[Translate to English:] Automatisierte Härteprüfanlage

[Translate to English:] FIB-SEM Innenansicht

[Translate to English:] FIB-SEM mit ToF-SIMS, EDX, EBSD, Ga+

[Translate to English:] FT-IR Spekrometer

[Translate to English:] Laserscanning-Mikroskop

[Translate to English:] Mikrotopographie mittels Stereo SEM Bilder und Mountains

[Translate to English:] SEM Bild koloriert

[Translate to English:] Weißlichtinterferometer

Photos 1,3,6,7,8,9 © Furtwangen University Alexander Filbert | Photos 2,10 © Furtwangen University Bernd Müller | Photo 5 © Furtwangen University Silicya Roth & Ribeiro Martins

There are a wide variety of coating systems that are used for the construction of microsystems:

Atomic layer deposition (thermal or plasma assisted). The vacuum chamber is integrated in a cluster system with RIE and PECVD
Vapour deposition of various materials
Chemical vapour deposition (CVD): PECVD (Si₃N₄with controllable voltage, SiC and amorphous Si, SiO₂)
Sputtering system (Pt, _Si3N4_,Ti, Al/Cu...)
Microplating: one Fontaine and one rack system

[Translate to English:] ALD-RIE-PECVD-Cluster

Photos © Furtwangen University Bernd Müller

Photolithography plays a crucial role in the production of microsystems and is an important structuring technique. There are various photolithographic processes in the laboratory, which are located in a yellow room.

Grayscale exposure for the creation of 3D structures
Direct laser exposure for structures up to 600 nm
In-house production of masks
Contact exposure / mask aligner
Alignment accuracy up to 200 nm, IR alignment, front to back alignment

[Translate to English:] Entwicklung Fotoresist

[Translate to English:] Mikro Mask Aligner

[Translate to English:] Maskenherstellung

[Translate to English:] Schreibkopf Laser

Photo 1 © Furtwangen University Silicya Roth & Ribeiro Martins | Photos 2,3,4,5 © Furtwangen University Bernd Müller

Oxidation © Furtwangen University Bernd Müller

Several tube furnaces are installed in the clean room, which are used for various applications in semiconductor technology.

Oxidation
Doping with boron and phosphorus
Diffusion
Tempering

[Translate to English:] Ätzbänke © Hochschule Furtwangen Silicya Roth & Ribeiro Martins

We have more than 25 different wet chemical etching tanks and several dry etching systems that enable us to structure a wide variety of layers. We have gained extensive experience in the anodization of porous silicon in particular.

Electrochemical etching: Anodizing systems for porous silicon in hydrofluoric acid solutions
Dry etching with plasma (RIE suitable for many materials)
Wet chemical etching (HF, Caro, KOH; Huang A/B...)

The chips are separated in the back-end area, followed by processing into ready-to-use systems.

Laser cutting
Wafer saw
Chip bonder
Wire bonder

[Translate to English:] Drahtbonden an einem Mikrofon

[Translate to English:] Mikro Laserschneider

For concept evaluation and analysis of the microsystems we work with:

FEM simulation using COMSOL Multiphysics®
Process simulation using IntelliSuite
Various CAD design programs
Tomography (of FIB-SEM images) with Dragonfly 3D World
Mountain SPIP®

[Translate to English:] FEM Simulation eines Miniaturisierten Inchworm aktuator

[Translate to English:] SolidWorks-Konstruktion eines Aktor System, inch-worm

[Translate to English:] Wirbelströme Mikrospule

Photo 2 © Furtwangen University Hussam Kloub | Photo 3 © Furtwangen University Bernhard Müller | Photo 4 © Furtwangen University Sonja Müller | Photo 5 © Furtwangen University Isman Khazi